Using recirculating chillers
Don’t land yourself in cold water. Protect your investment with a chiller
Substrate adhesion of sputtered films
An introductory explanation of substrate adhesion, and how this can be improved.
Plasma etching stages from Moorfield
Plasma etching is an excellent way to clean substrate surfaces, promote adhesion and optimise sample quality layers
Tools that fit like a glove
Research-grade vacuum deposition with inert sample handling
Coming to a screen near you
A new feature for our flexible PVD range
Moorfield’s nanoPVD-T15A new video
We’ve recently created a new video overview for our benchtop evaporator
Confocal magnetron sputtering
Confocal magnetron sputtering is now routinely employed for the production of excellent uniformity, multi-layer films by magnetron sputtering. This application note describes the technology, and explains the principles behind it.
New Australia & New Zealand distributor
Moorfield Nanotechnology Limited (Knutsford, UK) recently announced the appointment of a new distributor for their PVD, CVD and etch products for the Australia and New Zealand region.
Moorfield’s nanoPVD range goes from strength to strength
Four recent installations in London, Sweden, and Norway
PVD techniques
Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available.
Low temperature evaporation
The basics of Vacuum Evaporation Low temperature evaporation is a recent development in the field of vacuum evaporation. Traditional vacuum evaporation methods work, essentially, by heating materials to high temperatures. This is required for common thin-film evaporants so that they are vapourised from a source. The evaporants then move up through a process chamber to […]
Thermal evaporation
Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a range of materials, primarily metals.