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Thermal evaporation

Thermal evaporation is a straightforward means of thin film deposition with materials being heated to evaporation temperatures via a resistively heated support.

Thermal evaporation is best suited to metals with evaporation temperatures of about 1700 °C or below. Moorfield’s MiniLab range is ideally suited to the thermal evaporation technique.

Moorfield systems for Thermal evaporation:

Edwards e306

Moorfield have been working with the Edwards E306 system for more than 2 decades.
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MiniLab

The MiniLab range from Moorfield: Flexible, modular PVD systems for high-quality R&D and pilot-scale production.
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nanoPVD-T15A

High-performance metals, organic evaporation in compact packages for benchtop location. Superior, efficient performance and ideal for OLED, OPV and OFET research.
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Recent posts about Thermal evaporation:

Source selection for thermal evaporation

Thermal evaporation sources A thermal evaporation (TE) component typically consists of power supply rods, usually fashioned from thick copper, mounted to feedthroughs that allow
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Moorfield’s nanoPVD range goes from strength to strength

Four recent installations in London, Sweden, and Norway
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PVD techniques

Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available.
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Low temperature evaporation

The basics of Vacuum Evaporation Low temperature evaporation is a recent development in the field of vacuum evaporation. Traditional vacuum evaporation methods work, essentially,
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Thermal evaporation

Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing
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Electron-beam evaporation

Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in
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