Hybrid Benchtop PVD System
nanoPVD-ST15A Hybrid PVD System
Integrated sputtering and evaporation flexibility in one compact research platform.
The nanoPVD-ST15A is positioned for research groups that need a compact system covering both sputtering and evaporation methods for evolving device stacks and materials programmes.
Research-grade capability without enterprise complexity
This platform is positioned for research teams that need controllable thin-film process access, practical laboratory integration and clear configuration choices.
- One compact platform for sputtering and evaporation workflows
- Useful where the future process approach is not fixed
- Supports multilayers, electrodes and hybrid device stacks
- Configurable source and gas options
- Research-first automation and practical serviceability
Benefits that matter in a working research lab
Faster multilayer development
Combine sputtering and evaporation access locally so research teams can move quickly through hybrid film stacks, interfaces and process changes.
Ease of use for mixed-experience teams
Touchscreen control, saved recipes and a compact platform help different users work consistently across training, exploratory and device-development projects.
Hybrid research flexibility
A combined sputtering and thermal evaporation platform supports metals, insulating films, electrodes, interfaces and multi-material device stacks.
Lower operational friction
The compact format reduces the overhead of running separate deposition tools while keeping process capability close to the research workflow.
Better use of premium tools
Use local hybrid capability to prove stack concepts, then reserve larger tools for scale-up, advanced integration or high-demand shared-facility work.
Designed for real devices
Useful for multilayer thin films, hybrid device stacks, functional coatings, contacts, seed layers and early-stage semiconductor or quantum-material research.
Typical configurations
Use these examples as starting points. Moorfield can refine the final specification around your materials, substrates, gases, recipes and workflow constraints.
Hybrid device stacks
For multilayer thin-film research combining sputtered and evaporated materials.
- Sputtering plus thermal/LTE methods
- Sequential layer development
- Useful for exploratory device stacks
Contacts and interfaces
For projects requiring metal contacts plus dielectric or functional layers.
- Electrode and interface workflows
- Compact chamber integration
- Research process flexibility
Process exploration
For research groups that need one system before the final process approach is fixed.
- Flexible source choices
- Recipe-led iteration
- Lower infrastructure burden
Not sure which configuration is right for your research?
Discuss Your ApplicationKey features
Compact laboratory footprint
Research-grade thin-film capability in a practical benchtop format.
Configurable process approaches
Build around sputtering, evaporation or hybrid workflows depending on the model.
Recipe-led control
Touchscreen HMI and recipe workflows improve day-to-day repeatability.
High-vacuum platform
Turbomolecular pumping supports clean, controlled deposition conditions.
Flexible gas and source options
Process gases, source count and monitoring options can be matched to the application.
Research-first support
Moorfield helps specify the platform around your materials and target films.
Options and upgrades
Configure the platform around the process approach, substrate handling, automation and laboratory services your application needs. Options are confirmed with quotation for the final build.
Technical specifications
Exact specifications depend on final configuration and should be confirmed with quotation.
| System type | Hybrid benchtop PVD / sputtering plus thermal and LTE evaporation |
|---|---|
| Base pressure | 5×10-7 mbar |
| Sputter sources | Configurable water-cooled magnetrons |
| Evaporation sources | TE1 + LTE sources |
| Hybrid capability | Sputtering and evaporation in a single chamber |
| Reactive sputtering | Available through MFC gas control by configuration |
| Maximum substrate size | 4" (100 mm) |
| Substrate heating | Up to 500°C optional |
| Glovebox compatible | No |
| Warranty | 2 years |
Applications
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Related systems
Build the right nanoPVD-ST15A configuration for your research
Tell us about your materials, substrates, process gases and target films. Moorfield will help specify a practical system configuration.
nanoPVD-ST15A
Optimised for a combination of magnetron sputtering and thermal evaporation, the nanoPVD-ST15A offers the combination of evaporation and sputtering techniques within a single process chamber. Ultimate research flexibility within a benchtop, automated package.
nanoPVD-ST15A Benchtop PVD System
High-performance evaporation and magnetron sputtering techniques within one process chamber — all housed in a compact, modular package for benchtop deposition onto substrates of up to 4″ diameter. The nanoPVD-ST15A provides the ultimate flexibility for research-grade thin-film deposition requiring a space-friendly footprint.
The nanoPVD-ST15A has been purpose-designed to accommodate both vacuum evaporation and magnetron sputtering sources within a single process chamber. Available source types are low-temperature evaporation (LTE), standard resistive evaporation, and magnetron sputtering (2″ targets) for deposition of organics, dielectrics, and metals.
Each process chamber can hold up to 3 sources of up to 2 types. A full range of power supplies are available, allowing for deposition of multiple film types — metals, insulators, dielectrics and organics — using the same system and even within the same process run.
As with all nanoPVD tools, chamber access is via a hinged lid that opens to reveal a stage suitable for holding substrates up to 4″ in diameter. The chamber is tall, allowing for high-uniformity coating via fitted techniques.
The units are easy to control via a touchscreen HMI interface, simple to maintain, have low running costs and come with a comprehensive range of safety features.
With a turbomolecular pumping system, high-vacuum base pressures, straightforward automated control via a touchscreen HMI and a range of options for flexible configuration, the nanoPVD-ST15A combines the proven ease-of-use and high-end performance the nanoPVD range has become known for with ultimate application’s flexibility.
Key features
- Benchtop configuration
- Water-cooled magnetron sputtering sources for industry-standard 2″ targets
- MFC-controlled process gases
- DC and/or RF power supplies
- Fully automatic operation via touchscreen HMI
- Define/save multiple process recipes
- Up to 4” diameter substrates
- Base pressures <5 × 10-7 mbar
- Equipped for easy servicing
- Comprehensive safety features
- Cleanroom compatible
- Proven performance
Example nanoPVD Publications
Options
- Dry backing pump
- Fast chamber vent
- Automatic high-resolution pressure control
- Additional process gases
- 500 °C substrate heating stage
- Substrate rotation, Z-shift and shutters
- Up to 3 magnetron sputtering sources
- RF and/or DC power supplies
- High temperature thermal evaporation sources
- Low temperature thermal evaporation sources
- SputterSwitch power supply/source switching technology
- Co-deposition
- Quartz crystal sensor head
Typical configurations
Sputtering and metals evaporation
1 magnetron with RF power supply (metals and/or dielectrics), 2 thermal evaporation sources (metals) with single power supply and switch for shared output.
Automatic pressure control (Ar and O2 process gases), 500 °C substrate heating and quartz crystal sensor head for rate/thickness monitoring.
Sputtering and organics evaporation
2 magnetrons with DC power supply (metals) and SputterSwitch module for shared output, 1 low-temperature evaporation source (organics) with power supply.
Ar process gas, Z-shift and bi-shutter for best 4″ substrate geometries, quartz crystal sensor head for rate/thickness monitoring.
Service requirements
All nanoPVD-ST15A systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power. Exact requirements will be provided with quotations or on request.
Protect your investment and maximise uptime
Your Moorfield system is a long-term asset that needs to operate reliably and repeatably. A Service Plan is designed to protect your investment by reducing unplanned downtime, improving system reliability, and giving your team faster access to expert support when you need it.
All plans include an annual preventive maintenance visit (with documented checks) plus remote technical support—helpful for troubleshooting issues quickly without waiting for an on-site visit. As your needs increase, higher tiers add greater consumables/parts cover, discounted call-outs and travel, priority scheduling, and training refresher days to help new users get up to speed and reduce avoidable errors.
Service Plans also support easier budgeting (fixed annual or monthly options on eligible tiers) and provide multi-system discounts.
Ask us which plan best fits your throughput demands and budget priorities using our CONTACT US FORM