nanoETCH

The nanoETCH implements Moorfield’s unique soft-etching technology and provides the fine etching control crucial for graphene and 2D materials research in a convenient, benchtop package.

Techniques:

The nanoETCH implements Moorfield’s unique soft-etching technology and provides the fine etching control crucial for graphene and 2D materials research in a convenient, benchtop package.

As a result, and in contrast to conventional etching solutions, the tool enables high-performance for key applications in graphene and 2D materials:

  • Substrate preparation for flake exfoliation: Large-area flakes through surface conditioning
  • Clean material patterning: Graphene removal without resist residues
  • Defect engineering: Creating defects in graphene layers

As standard, the system is suitable for accepting substrates up to 3″ diameter. A turbomolecular pumping system enables contamination-free operation. Substrates rest on a purpose-designed stage, and power is supplied from an RF unit engineered to allow for fine control at low powers. Together with carefully modelled in-chamber RF acoustics, this provides the tool with its unique capabilities.

The system can be connected to a PC for data-logging. The nanoETCH tool is now installed in leading graphene/2D material research labs, including ICFO (Spain), the Cambridge Graphene Centre and the UK National Graphene Institute.

Download the product brochure


    Key features

    • Benchtop configuration
    • Soft-etching technology: Precision RF power <30 W
    • MFC-controlled process gases
    • Up to 6” diameter stages
    • Fully automatic operation via touchscreen HMI
    • Define/save multiple process recipes
    • PC connection for data-logging
    • Base pressures <5 × 10-7mbar
    • Equipped for easy servicing
    • Comprehensive safety features
    • Cleanroom compatible
    • Proven performance

    Options

    • Dry backing pump
    • Fast chamber vent
    • Ultra-high resolution RF power control
    • Automatic high-resolution pressure control
    • Additional process gases

    Typical configurations

    Service requirements

    All nanoETCH systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power. Exact requirements will be provided with quotations or on request.

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