PVD techniques

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Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available.
nanoPVD-T15A chamber interior with two TE1 sources for metals evaporation
Electron Beam Evaporation

Electron-Beam Evaporation

Electron-beam (e-beam) evaporation is a type of physical vapour deposition in which a material to be deposited is heated to a temperature at which it evaporates, by bombardment with a beam of electrons.

PVD Techniques – Thermal Evaporation

Thermal Evaporation

Thermal evaporation is a common, straightforward means of thin film deposition typically used to deposit metals. Materials are heated, under vacuum, to temperatures at which they evaporate or sublime

Low temperature evaporation

Low-Temperature Evaporation

Low-temperature evaporation, or LTE, is ideal for deposition of high vapour-pressure materials such as organic compounds used in OLED and photovoltaic technologies.

Magnetron Sputtering

Magnetron Sputtering

In sputtering, deposition material is ejected from a target surface through bombardment by plasma ions. The technique is suited to high melting-point materials and provides excellent coating-substrate adhesion.

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Graphene soft-etching with the nanoETCH

Moorfield graphene soft-etching technology allows for the controlled removal of graphene and 2D materials, without cross-linking photoresists that can lead to residual contamination that affects device performance.

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Confocal magnetron sputtering

Confocal magnetron sputtering

Confocal magnetron sputtering is now routinely employed for the production of excellent uniformity, multi-layer films by magnetron sputtering. This application note describes the technology, and explains the principles behind it.

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