Long read

Graphene soft-etching with the nanoETCH

Moorfield graphene soft-etching technology allows for the controlled removal of graphene and 2D materials, without cross-linking photoresists that can lead to residual contamination that affects device performance.

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Confocal magnetron sputtering

Confocal magnetron sputtering

Confocal magnetron sputtering is now routinely employed for the production of excellent uniformity, multi-layer films by magnetron sputtering. This application note describes the technology, and explains the principles behind it.

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Magnetron sputtering

Magnetron sputtering

Magnetron sputtering is a versatile technique suited to a wide range of materials – and provides excellent coating-substrate adhesion.

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Physical Vapour Deposition

Low temperature evaporation

The basics of Vacuum Evaporation Low temperature evaporation is a recent development in the field of vacuum evaporation. Traditional vacuum evaporation methods work, essentially, by

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Thermal evaporation

Thermal evaporation

Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a range of materials, primarily metals. 

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E-Beam featured

Electron-beam evaporation

Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the 10-7 mbar region, or lower). This in-turn releases a vapour that moves up through a process chamber and coats a substrate at the top.

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