The MiniLab 060 standard configuration includes a turbomolecular pump positioned on an ISO160 port at the rear of the vacuum chamber. The vacuum chamber sits on a double-rack frame that contains all system control electronics and power supplies. MiniLab 060 systems are available with load-locks—please call for details.
Tools can be equipped with a wide variety of deposition techniques, including thermal and low-temperature evaporation sources (for metals and organics), magnetron sputtering cathodes (for metals and inorganics), and electron-beam sources (for most material classes except organics). Deposition sources are typically mounted on the chamber baseplate, but sputter-down configurations are also available.
Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.
Thermal evaporation (metals):
Four-source TE4 thermal evaporation component with source shutters and rotation stage. High power TEC-4A power supply and controller with recipe-based automated control. Quartz crystal sensor head with PC software for rate/thickness monitoring.
Thermal evaporation (metals and organics):
Two TE1 thermal evaporation sources for metals and two LTE-1CC components for organics. Source shutters and rotation stage. Evaporation power supplies linked to quartz crystal sensor head and Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
Multi-pocket (e.g., 6 × 7 cc or 8 × 4 cc) water-cooled e-beam source with 5 kW power supply/controller and automated pocket selection. Source and substrate shutters, and rotation. Quartz crystal sensor heads with Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
Up to four water-cooled magnetron sources for 3″ circular targets. RF and DC power supplies with SputterSwitch technology for shared outputs. Source shutters and substrate rotation. Recipe-based power vs. time process control.
All MiniLab 060 tools require chilled water, dry compressed air, nitrogen for venting (optional) and electrical power (three-phase for e-beam evaporation). Sputtering systems also require process gases (argon, oxygen and nitrogen). Exact requirements will be provided with quotations or on request.
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