Thermal evaporation sources A thermal evaporation (TE) component typically consists of power supply rods, usually fashioned from thick copper, mounted to feedthroughs that allow transmission
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Moorfield Nanotechnology Limited (Knutsford, UK) recently announced the appointment of a new distributor for their PVD, CVD and etch products for the Australia and New Zealand region.
Four recent installations in London, Sweden, and Norway
Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available.
Magnetron sputtering is a versatile technique suited to a wide range of materials – and provides excellent coating-substrate adhesion.
The basics of Vacuum Evaporation Low temperature evaporation is a recent development in the field of vacuum evaporation. Traditional vacuum evaporation methods work, essentially, by
Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a range of materials, primarily metals.
Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the 10-7 mbar region, or lower). This in-turn releases a vapour that moves up through a process chamber and coats a substrate at the top.
New Overview Video for our Physical Vapour Deposition (PVD) System
Moorfield have supplied and manufactured two UHV chambers which will form the core of a new system in the Surface, Interface & Thin Film Group at Warwick University
New Chinese distribution partner
Moorfield Nanotechnology have recently appointed a distributor in China for their PVD, CVD, and etch systems.
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