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MiniLab 090

MiniLab 090 systems are glovebox-compatible for atmosphere-sensitive applications. Tall chambers are ideal for high-performance evaporation, but magnetron sputtering is also available.

Techniques:

Thermal evaporation // Low-temperature thermal evaporation (LTE) // E-beam evaporation // Magnetron sputtering

MiniLab 090 systems are floor-standing PVD tools for metals, dielectrics and/or organics deposition. All systems contain a box-type stainless-steel chamber with front and rear doors for glovebox integration (allows for both through-glovebox and external service access).

The chamber has a high aspect-ratio, ideal for long working distances for high uniformity coating via evaporative techniques, but systems can also be equipped with magnetron sputtering. A turbomolecular pumping system is standard, for high-vacuum base pressures of better than 5 × 10-7 mbar. Exact configuration is extremely flexible and dependent on customer budgets and applications. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.

Download the system PDF

Key features

  • Modular design
  • Front sliding door for in-glovebox loading
  • Rear door for service access
  • Turbomolecular or cryo pumping systems
  • Base pressures <5 × 10-7 mbar
  • Metals, dielectrics and organics deposition
  • Up to 11” diameter substrates
  • Touchscreen HMI/PC for system control
  • Equipped for easy servicing
  • Comprehensive safety features and interlocks
  • Cleanroom compatible

Options

  • Pumping: Turbomolecular or cryogenic high-vacuum pumps, rotary or scroll backing pumps.
  • Gas/pressure: Manual or automatic control via MFCs and throttle valves.
  • Load-locks: Single- and multiple-sample.
  • Stages: Rotation, heating, cooling, Z-shift, bias and planetary.
  • Shutters: Source and substrate, pneumatic or motorised.
  • Operation: Manual or automatic via front panels, touchscreen HMI or PC.
  • Process: Quartz crystal sensor heads for rate/thickness monitoring or feedback-loop control.

Typical configurations:

Thermal evaporation (metals):

Four-source TE4 thermal evaporation component with source shutters and rotation stage. High power TEC-4A power supply and controller with recipe-based automated control. Quartz crystal sensor head with PC software for rate/thickness monitoring.

Thermal evaporation (metals and organics)

Two TE1 thermal evaporation sources for metals and four LTE-1CC components for organics. Source shutters and rotation stage. Evaporation power supplies linked to quartz crystal sensor head and Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.

E-beam evaporation

Multi-pocket (e.g., 6 × 7 cc or 8 × 4 cc) water-cooled e-beam source with 5 kW power supply/controller and automated pocket selection. Source and substrate shutters, and rotation. Quartz crystal sensor heads with Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.

Magnetron sputtering

Up to four water-cooled magnetron sources for 3″ circular targets. RF and DC power supplies with SputterSwitch technology for shared outputs. Source shutters and substrate rotation. Recipe-based power vs. time process control.Magnetron sputtering sources can be added alongside the above techniques.

Service requirements:

All MiniLab 090 tools require chilled water, dry compressed air, nitrogen for venting (optional) and electrical power (three-phase for e-beam evaporation). Sputtering systems also require process gases (argon, oxygen and nitrogen). Exact requirements will be provided with quotations or on request.

Get a quote for a MiniLab 090

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