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High-Capability Modular PVD System

MiniLab 125 High-Capability Modular PVD System

Larger modular PVD platform for complex multi-source, multi-technique and larger-substrate research programmes.

MiniLab 125 is Moorfield’s high-capability research platform for source capacity, larger substrates, advanced power options and future process flexibility.

SubstratesUp to 12 inch
SourcesUp to 5 sources
OptionsE-beam / HiPIMS
MiniLab 125 high-capability modular PVD system
MiniLab 125 high-capability modular PVD system

Research-grade capability without enterprise complexity

This platform is positioned for research teams that need controllable thin-film process access, practical laboratory integration and clear configuration choices.

  • Capability headroom for demanding R&D programmes
  • Larger-substrate configuration for advanced thin-film work
  • Multi-source and multi-technique configuration options
  • HiPIMS, pulsed DC, e-beam and diagnostics by project
  • Research-first alternative to production-scale complexity

Typical configurations

Use these examples as starting points. Moorfield can refine the final specification around your materials, substrates, gases, recipes and workflow constraints.

High-capability sputtering

For larger and more complex sputtered film programmes.

  • Up to 5 source configuration
  • Advanced power options
  • Reactive process development

Multi-technique R&D

For labs that need sputtering, evaporation and e-beam pathways in one platform.

  • Thermal and e-beam options
  • QCM and diagnostics
  • Flexible chamber architecture

Future-ready research platform

For programmes where capability requirements are expected to grow.

  • Large-substrate configuration
  • Integration and transfer options
  • Long-term adaptability

Not sure which configuration is right for your research?

Discuss Your Application

Key features

Modular research architecture

Configure sources, chambers, stages and monitoring around the research programme.

Multi-technique capability

Combine sputtering, evaporation, e-beam and specialist process modules where required.

Advanced process control

Support for recipe-led workflows, monitoring, gas handling and advanced power options.

Scalable laboratory integration

Move beyond benchtop limits without defaulting to production-scale complexity.

Application-specific options

Load-lock, bias, heating and diagnostic options can be specified by project.

Long-term adaptability

The system can be configured and expanded as research priorities evolve.

Options and upgrades

Configure the platform around the process approach, substrate handling, automation and laboratory services your application needs. Options are confirmed with quotation for the final build.

Vacuum and transfer

  • Optional Load Lock (up to 8″ substrates)
  • Transfer automation
  • Dual chamber option
  • Dry pumping options
  • Process gas expansion
  • Chamber cooling

Sources and power

  • Up to 5 sources; 6 as special build
  • Ferrotec 3-6 kW e-beam evaporation
  • TE1 + LTE thermal evaporation sources
  • HiPIMS / pulsed DC option
  • NPS, RGA, ion beam and beam-assisted deposition methods
  • Ion Beam Source

Control and substrate handling

  • PC + IntelliDep control architecture
  • Substrate heating up to 800°C with SSIC heater
  • RF + DC substrate bias
  • QCM rate/thickness monitoring
  • Cooling, tilt, planetary stage and masking options
  • Substrate cooling

Technical specifications

Exact specifications depend on final configuration and should be confirmed with quotation.

System typeHigh-capability MiniLab modular PVD
Base pressure (HV)5×10-7 mbar
Max sputter sourcesUp to 5 sources; 6 as special build
E-beam evaporationFerrotec 3-6 kW
Thermal / LTE evaporationTE1 + LTE sources available
Other techniquesNPS, RGA, ion beam and beam-assisted deposition
HiPIMS / pulsed DCAvailable; HiPSTER 1 + Pinnacle 1.5 kW power supply option
Maximum substrate size12″ (300 mm)
Substrate heatingUp to 800°C with SSIC heater
Substrate biasRF + DC bias
Load lockOptional Load Lock (up to 8″ substrates)
Glovebox compatibleNot listed in supplied comparison
Dual chamberAvailable
Control softwarePC + IntelliDep software
Rate / thickness monitoringUp to 4 x water-cooled QCM + optional SQC-310 controller
Chamber materialStainless steel; enables CF flanges
Warranty2 years

Applications

Application-library examples where MiniLab 125 and related MiniLab configurations are cited in nanoparticle, photoreduction and device-structure research.

Build the right MiniLab 125 configuration for your research

Tell us about your materials, substrates, process gases and target films. Moorfield will help specify a practical system configuration.

MiniLab 125

Optimised for multi-technique applications, the MiniLab 125 is a modular magnetron sputtering and thermal evaporation PVD system for subrates up to 11″ diameter.

Modular magnetron sputtering and thermal evaporation PVD thin film deposition system

MiniLab 125 Modular PVD System

Optimised for multi-technique applications, a modular magnetron sputtering and thermal evaporation PVD system for substrates up to 11″ diameter.

Deposition sources are typically mounted on the chamber baseplate, but sputter-down configurations are also available.

Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.

Key features
  • Modular design
  • Turbomolecular or cryo-pumping systems
  • Base pressures <5 × 10-7 mbar
  • Metals, dielectrics and organics deposition
  • Up to 11” diameter substrates
  • Touchscreen HMI/PC for system control
  • Equipped for easy servicing
  • Comprehensive safety features and interlocks
  • Cleanroom compatible
Example MiniLab Publications
Options
  • Pumping: Turbomolecular or cryogenic high-vacuum pumps, rotary or scroll backing pumps
  • Gas/pressure: Manual or automatic control via MFCs and throttle valves
  • Load-locks: Single- and multiple-sample
  • Stages: Rotation, heating, cooling, Z-shift, bias and planetary
  • Shutters: Source and substrate, pneumatic or motorised
  • Operation: Manual or automatic via front panels, touchscreen HMI or PC
  • Process: Quartz crystal sensor heads for rate/thickness monitoring or feedback-loop control
Example Configurations
System Images
Protect your investment and maximise uptime

Your Moorfield system is a long-term asset that needs to operate reliably and repeatably. A Service Plan is designed to protect your investment by reducing unplanned downtime, improving system reliability, and giving your team faster access to expert support when you need it.

All plans include an annual preventive maintenance visit (with documented checks) plus remote technical support—helpful for troubleshooting issues quickly without waiting for an on-site visit. As your needs increase, higher tiers add greater consumables/parts cover, discounted call-outs and travel, priority scheduling, and training refresher days to help new users get up to speed and reduce avoidable errors.

Service Plans also support easier budgeting (fixed annual or monthly options on eligible tiers) and provide multi-system discounts.

Ask us which plan best fits your throughput demands and budget priorities using our CONTACT US FORM