Skip to content
Menu

Products > MiniLab > MiniLab 070

Advanced Modular Sputtering System

MiniLab 070 Modular Sputtering System

Advanced modular sputtering for multi-source thin-film R&D.

MiniLab 070 is the MiniLab sputtering workhorse for research teams needing more sources, larger substrates, process gases, bias, QCM monitoring and advanced power options.

Sources4 x 3 inch sources
SubstratesUp to 8 inch
OptionsHiPIMS / pulsed DC
MiniLab 070 modular sputtering system
MiniLab 070 modular sputtering system

Research-grade capability without enterprise complexity

This platform is positioned for research teams that need controllable thin-film process access, practical laboratory integration and clear configuration choices.

  • Multi-source sputtering capability for advanced research
  • RF, DC, pulsed DC and HiPIMS options by configuration
  • QCM monitoring and process-control options
  • Modular platform for evolving research programmes

Typical configurations

Use these examples as starting points. Moorfield can refine the final specification around your materials, substrates, gases, recipes and workflow constraints.

Multi-source sputtering

For research teams developing multilayers, alloys and functional coatings.

  • 4 x 3 inch source capability
  • Reactive gas options
  • Sequential and co-deposition workflows

Advanced power development

For projects that need more than standard DC or RF sputtering.

  • HiPIMS and pulsed DC options
  • Bias and monitoring options
  • Process development flexibility

Larger substrate R&D

For thin-film development beyond benchtop substrate limits.

  • Up to 8 inch (200 mm) substrate positioning
  • MiniLab platform scale
  • Research-first configuration

Not sure which configuration is right for your research?

Discuss Your Application

Key features

Modular research architecture

Configure sources, chambers, stages and monitoring around the research programme.

Multi-technique capability

Combine sputtering, evaporation, e-beam and specialist process modules where required.

Advanced process control

Support for recipe-led workflows, monitoring, gas handling and advanced power options.

Scalable laboratory integration

Move beyond benchtop limits without defaulting to production-scale complexity.

Application-specific options

Glovebox, load-lock, bias, heating and diagnostic options can be specified by project.

Long-term adaptability

The system can be configured and expanded as research priorities evolve.

Options and upgrades

Configure the platform around the process approach, substrate handling, automation and laboratory services your application needs. Options are confirmed with quotation for the final build.

Vacuum and transfer

  • Optional Load Lock (up to 8″ substrates)
  • Transfer automation
  • Dual chamber option
  • Dry pumping options
  • Process gas expansion
  • Chamber cooling

Sources and power

  • Up to 4 x 3″ sputter sources
  • TE1 + LTE thermal evaporation sources
  • HiPIMS / pulsed DC option
  • Ion Beam Source

Control and substrate handling

  • PC + IntelliDep control architecture
  • Substrate heating up to 800°C with SSIC heater
  • RF + DC substrate bias
  • QCM rate/thickness monitoring
  • Cooling, tilt, planetary stage and masking options
  • Substrate cooling

Technical specifications

Exact specifications depend on final configuration and should be confirmed with quotation.

System typeMiniLab modular PVD
Base pressure (HV)5×10-7 mbar
Max sputter sources4 x 3″
E-beam evaporationTelemark 246
Thermal / LTE evaporationTE1 + LTE sources available
HiPIMS / pulsed DCAvailable; HiPSTER 1 + Pinnacle 1.5 kW power supply option
Maximum substrate size8″ (200 mm)
Substrate heatingUp to 800°C with SSIC heater
Substrate biasRF + DC bias
Load lockOptional Load Lock (up to 8″ substrates)
Glovebox compatibleNot compatible
Dual chamberAvailable
Control softwarePC + IntelliDep software
Rate / thickness monitoringUp to 4 x water-cooled QCM + optional SQC-310 controller
Chamber materialStainless steel; enables CF flanges
Warranty2 years

Applications

MiniLab family application-library examples for modular thin-film workflows, sensors, optical structures and process-development examples.

High-Efficiency Semitransparent Solar Cells

Publication Title: High‐Efficiency Semitransparent Solar Cells Based on Magnetron Sputtered Sb 2 S 3 Thin Films

Lead facility: Luleå University of Technology

Moorfield product cited: MiniLab 070

Read application

Transmissive Hybrid Metal-Dielectric

Publication Title: Transmissive hybrid metal–dielectric metasurface bandpass filters for mid‐infrared applications

Lead facility: University of Cambridge

Moorfield product cited: MiniLab 070

Read application

Direct synthesis of nanopatterned graphene

Publication Title: Direct synthesis of nanopatterned epitaxial graphene on silicon carbide

Lead facility: University of Technology Sydney

Moorfield product cited: nanoPVD-S10A

Read application

Direct Single-Molecule Detection in Super Resolution

Publication Title: Direct single-molecule detection and super-resolution imaging with a low-cost portable smartphone-based microscope

Lead facility: University of Fribourg

Moorfield product cited: MiniLab 080

Read application

Effect of Pt coating on electrochemical behaviour

Publication Title: Engineering Cu 2 O Nanowire Surfaces for Photoelectrochemical Hydrogen Evolution Reaction

Lead facility: Luleå University of Technology

Moorfield product cited: MiniLab 070

Read application

Thin Film Bragg Reflector for Monolithic GaAs Devices

Publication Title: Thin Film Bragg Reflector for Monolithic GaAs Devices

Lead facility: Not stated in publication metadata

Moorfield product cited: MiniLab 125

Read application

Build the right MiniLab 070 configuration for your research

Tell us about your materials, substrates, process gases and target films. Moorfield will help specify a practical system configuration.

MiniLab 070

MiniLab 070 PVD systems have front-loading box-type chambers and are optimised for magnetron sputtering for substates up to 11″ diameter.

Modular PVD thin film deposition system optimised for magnetron sputtering

MiniLab 070 Modular PVD System

Optimised for magnetron sputtering for substrates up to 11″ diameter. The vacuum chamber sits on a double-rack frame that contains all system control electronics and power supplies. 

Deposition sources are typically mounted on the chamber baseplate, but sputter-down configurations are also available.

Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully automated process control.

Key features
  • Modular design
  • Front-loading box-type vacuum chamber
  • Turbomolecular and cryo pumping systems
  • Base pressures <5 × 10-7 mbar
  • Metals, dielectrics and organics deposition
  • Up to 11” diameter substrates
  • Up to 4 sources
  • Touchscreen HMI/PC for system control
  • Equipped for easy servicing
  • Comprehensive safety features and interlocks
  • Cleanroom compatible
  • Load-locks available
Example MiniLab Publications
Options
  • Pumping: Turbomolecular or cryogenic high-vacuum pumps, rotary or scroll backing pumps.
  • Gas/pressure: Manual or automatic control via MFCs and throttle valves.
  • Load-locks: Single- and multiple-sample.
  • Stages: Rotation, heating, cooling, Z-shift, bias and planetary.
  • Shutters: Source and substrate, pneumatic or motorised
  • Operation: Manual or automatic via front panels, touchscreen HMI or PC.
  • Process: Quartz crystal sensor heads for rate/thickness monitoring or feedback-loop control.
Example Configurations
System Images
Protect your investment and maximise uptime

Your Moorfield system is a long-term asset that needs to operate reliably and repeatably. A Service Plan is designed to protect your investment by reducing unplanned downtime, improving system reliability, and giving your team faster access to expert support when you need it.

All plans include an annual preventive maintenance visit (with documented checks) plus remote technical support—helpful for troubleshooting issues quickly without waiting for an on-site visit. As your needs increase, higher tiers add greater consumables/parts cover, discounted call-outs and travel, priority scheduling, and training refresher days to help new users get up to speed and reduce avoidable errors.

Service Plans also support easier budgeting (fixed annual or monthly options on eligible tiers) and provide multi-system discounts.

Ask us which plan best fits your throughput demands and budget priorities using our CONTACT US FORM