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Wide-Area Benchtop PVD System

nanoPVD-S10A-WA Wide-Area PVD System

Compact wide-area RF/DC magnetron sputtering for larger research substrates and coating areas.

The nanoPVD-S10A-WA extends the compact nanoPVD sputtering workflow where standard 4 inch coverage is too restrictive, while keeping the system practical for research laboratories and cleanrooms.

Substrate capabilityUp to 8 inch wide-area
ProcessRF/DC sputtering
PositionCompact wide-area PVD
nanoPVD-S10A-WA wide-area benchtop PVD system
nanoPVD-S10A-WA wide-area benchtop PVD system

Research-grade capability without enterprise complexity

This platform is positioned for research teams that need controllable thin-film process access, practical laboratory integration and clear configuration choices.

  • Wide-area sputtering without moving straight to a large modular system
  • RF/DC process flexibility for conductive and non-conductive materials
  • Configurable source, gas and pressure-control options
  • Recipe-led operation for repeatable research workflows
  • Designed for research labs, cleanrooms and process development

Benefits that matter in a working research lab

Faster wide-area coating cycles

Bring larger-substrate PVD experiments closer to the research team and iterate coating geometry, recipe settings and film properties without waiting for larger shared tools.

Ease of use for mixed-experience teams

Touchscreen operation and recipe-led workflows support day-to-day use by researchers, students and technical teams working across changing projects.

Wide-area research flexibility

The platform extends compact nanoPVD workflows where standard benchtop coverage is too restrictive, while retaining configurable RF/DC sputtering options.

Lower operational friction

Add practical wide-area sputtering capability in a laboratory or cleanroom without the operational burden of production-scale equipment.

Better use of premium tools

Screen larger-area films locally, then move validated processes to central facilities only when throughput, wafer scale or advanced integration requires it.

Designed for device-relevant films

Useful for PV, sensors, optoelectronics, functional coatings, transparent conductive layers and larger-area materials-development samples.

Typical configurations

Use these examples as starting points. Moorfield can refine the final specification around your materials, substrates, gases, recipes and workflow constraints.

Wide-area metals deposition

For contact metals, electrodes and seed layers where coating area matters.

  • RF/DC sputtering process
  • Larger substrate coverage than standard compact systems
  • Useful for device and coating R&D

TCO and dielectrics

For transparent conductive oxides and insulating films that need controlled sputter conditions.

  • RF power option
  • Oxygen process gas options
  • Useful for PV, sensors and optoelectronics

Functional coatings

For exploratory coating workflows where compact footprint and larger coating area both matter.

  • Research-friendly system scale
  • Recipe-led process access
  • Application-specific configuration

Not sure which configuration is right for your research?

Discuss Your Application

Key features

Compact laboratory footprint

Research-grade thin-film capability in a practical benchtop format.

Configurable process approaches

Build around sputtering, evaporation or hybrid workflows depending on the model.

Recipe-led control

Touchscreen HMI and recipe workflows improve day-to-day repeatability.

High-vacuum platform

Turbomolecular pumping supports clean, controlled deposition conditions.

Flexible gas and source options

Process gases, source count and monitoring options can be matched to the application.

Research-first support

Moorfield helps specify the platform around your materials and target films.

Options and upgrades

Configure the platform around the process approach, substrate handling, automation and laboratory services your application needs. Options are confirmed with quotation for the final build.

Vacuum and gas handling

  • Dry backing pump
  • Fast chamber vent
  • Capacitance manometer and optional MFC closed-loop pressure control
  • Up to 3 MFC-controlled process gases

Deposition and power

  • Up to 3 x 2″ water-cooled magnetron sputtering sources
  • 780 W DC and/or 150 W, 13.56 MHz RF power supplies with auto-match
  • High-strength magnet pack for magnetic target sputtering
  • SputterSwitch source/power routing where specified
  • In-situ rate and thickness monitoring

Substrate handling

  • Substrate heating up to 500°C
  • Substrate cooling option
  • RF and DC substrate bias option
  • Rotation, Z-shift and shutters where specified

Technical specifications

Exact specifications depend on final configuration and should be confirmed with quotation.

System typeWide-area benchtop PVD / DC and RF magnetron sputtering
Base pressure5×10-7 mbar
Pressure controlCapacitance manometer + MFC closed-loop control as an option
Process gas inletsUp to 3 MFC-controlled gases
Sputter sourcesUp to 3 x 2″ water-cooled magnetrons
Target size2″
Reactive sputteringYes; up to 3 MFCs with optional closed-loop control
Magnetic target sputteringHigh-strength magnet pack available
Maximum substrate size8″ (200 mm)
Substrate heatingUp to 500°C optional
Substrate coolingAvailable as an option
Substrate biasRF and DC bias available as an option
Load lockNot available as standard
Glovebox compatibleNo
Process controlIndustrial PLC + 7″ HMI touchscreen
Recipe controlRecipe save/load standard
Warranty2 years

Applications

Application-library examples for wide-area and related nanoPVD sputtering workflows. The product cited is shown on each card so the evidence path stays clear.

MoO3 and Hard Carbon Architecture

Publication Title: Designing Molybdenum Trioxide and Hard Carbon Architecture for Stable Lithium-Ion Battery Anodes

Lead facility: Northumbria University

Moorfield product cited: nanoPVD-S10A-WA, nanoPVD-S10A

Read application

Influence of DC Sputtering Power on Ti Films

Publication Title: Influence of Sputtering DC Sputtering Power on the Surface Evolution of Ti Thin Films: A Fractal Description

Lead facility: University of Johannesburg

Moorfield product cited: nanoPVD-S10A

Read application

HMR-Based Optical Gas Detection.

Publication Title: HMR-Based Optical Gas Detection With CuO and ZnO Coatings

Lead facility: Universidad Publica de Navarra

Moorfield product cited: nanoPVD-S10A

Read application

Evolution of TiAlSi Thin Film Coatings

Publication Title: Evolution of TiAlSi thin film coatings under varying target power in DC magnetron sputtering

Lead facility: Northumbria University

Moorfield product cited: nanoPVD-S10A

Read application

In-situ monitoring of Aptamer-Protein binding

Publication Title: In Situ Monitoring of Aptamer–Protein Binding on a ZnO Surface Using Spectroscopic Ellipsometry

Lead facility: University of Liverpool

Moorfield product cited: nanoPVD-S10A

Read application

sp2-rich dendrite-like carbon nanowalls

Publication Title: sp2 -rich dendrite-like carbon nanowalls as effective electrode for environmental monitoring of explosive nitroaromatic

Lead facility: Gdańsk University of Technology

Moorfield product cited: nanoPVD-S10A

Read application

Bioz citation lookup

Publication Title: Bioz citation results for nanoPVD-S10A-WA

Lead facility: Multiple published sources where available in Bioz

Moorfield product cited: nanoPVD-S10A-WA

View Bioz citations

Build the right nanoPVD-S10A-WA configuration for your research

Tell us about your materials, substrates, process gases and target films. Moorfield will help specify a practical system configuration.

nanoPVD-S10A-WA

Optimised for magnetron sputtering, the nanoPVD-S10A-WA is a Wide-Area configuration that extends the capabilities of the nanoPVD-S10A to allow for even coating of substrate diameters up to 8″, in a benchtop package.

nanoPVD-S10A-WA Benchtop PVD System

The wide-area version of the nanoPVD-S10A contains magnetron sputtering sources oriented directly upwards towards substrate platens. This arrangement in combination with substrate rotation and exposure plates with specially designed orifices allows for coating of substrates up to 8″ diameter for applications in which tight uniformity specifications are not critical.

Like the nanoPVD-S10A, magnetrons are water-cooled for sustained high-power operation and accept industry-standard targets. In addition, nanoPVD-S10A-WA units come with all attractive features of the nanoPVD range including turbomolecular pumping systems, recipe-based automated operation via touchscreen HMIs, and compact designs for benchtop location.

Key features
  • Benchtop configuration
  • Water-cooled magnetron sputtering sources for industry-standard 2″ targets
  • MFC-controlled process gases
  • DC and/or RF power supplies
  • Fully automatic operation via touchscreen HMI
  • Define/save multiple process recipes
  • Up to 8” diameter substrates
  • Base pressures <5 × 10-7 mbar
  • Equipped for easy servicing
  • Comprehensive safety features
  • Cleanroom compatible
  • Proven performance
Example Publications
Options
  • Dry backing pump
  • Fast chamber vent
  • Automatic high-resolution pressure control
  • Additional process gases
  • 500 °C substrate heating stage
  • Substrate rotation, Z-shift and shutters
  • Up to 2 magnetron sputtering sources
  • RF and/or DC power supplies
  • SputterSwitch power supply/source switching technology
  • Co-deposition
  • Quartz crystal sensor head
Typical configurations

The nanoPVD-S10-WA is a semi-custom tool, with final design being subject to customer requirements.

Service requirements

All nanoPVD-S10A systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power. Exact requirements will be provided with quotations or on request.

Protect your investment and maximise uptime

Your Moorfield system is a long-term asset that needs to operate reliably and repeatably. A Service Plan is designed to protect your investment by reducing unplanned downtime, improving system reliability, and giving your team faster access to expert support when you need it.

All plans include an annual preventive maintenance visit (with documented checks) plus remote technical support—helpful for troubleshooting issues quickly without waiting for an on-site visit. As your needs increase, higher tiers add greater consumables/parts cover, discounted call-outs and travel, priority scheduling, and training refresher days to help new users get up to speed and reduce avoidable errors.

Service Plans also support easier budgeting (fixed annual or monthly options on eligible tiers) and provide multi-system discounts.

Ask us which plan best fits your throughput demands and budget priorities using our CONTACT US FORM