nanoPVD-S10A Benchtop PVD System
Optimised for magnetron sputtering for substrates up to 4″ diameter. Compatible with DC and/or RF power supplies for deposition of metals or insulating materials such as oxides or nitrides.
Magnetrons (up to 3 can be fitted) are water-cooled, allowing for high powers and sustained operation, and sized for accepting industry-standard targets. Units have turbomolecular pumping systems for low-contamination operation. Co-deposition is possible, as is reactive sputtering via the gas/pressure control module that can support up to 3 process gases.
Chamber access is via a hinged lid, that opens to reveal a stage suitable for holding substrates up to 4″ diameter.
The units are easy to control via a touchscreen interface, simple to maintain, have low running costs and come with a comprehensive range of safety features.
Options
- Dry backing pump
- Fast chamber vent
- Automatic high-resolution pressure control
- Additional process gases
- Stage heating to 500°C
- Substrate rotation, Z-shift and shutters
- Up to 3 magnetron sputtering sources
- RF and/or DC power supplies
- SputterSwitch power supply/source switching technology
- Co-deposition
- In-situ rate and thickness monitoring
Key features
- Benchtop configuration
- Water-cooled magnetron sputtering sources for industry-standard 2″ targets
- Process gas introduction via Mass Flow Controllers
- DC and/or RF power supplies
- Fully automatic operation via touchscreen HMI
- Define/save multiple process recipes
- Up to 4” diameter substrates
- Base pressures <5E-07 mbar
- Equipped for easy servicing
- Comprehensive safety features
- Cleanroom compatible
- Proven performance
Typical configurations
Metals deposition:
2 magnetrons with DC power supply and SputterSwitch module for shared output, substrate Z-shift and bi-shutter for best 4″ substrate geometries, quartz crystal sensor head for rate/thickness calibration.
TCO/dielectrics sputtering:
2 magnetrons with RF power supply and SputterSwitch module for shared output, substrate heating and additional oxygen process gas line for enhanced film properties, substrate Z-shift and bi-shutter. Quartz crystal sensor head.
Reactive/co-deposition:
3 magnetrons with RF and DC power supplies and SputterSwitch module for fully-flexible power supply/source routing. 3 process gases (argon, oxygen and nitrogen) for reactive deposition of oxides and nitrides.
Service requirements
All nanoPVD-S10A systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power. Exact requirements will be provided with quotations or on request.