Benchtop PVD System

nanoPVD-S10A Benchtop PVD System

Compact, research-grade RF/DC magnetron sputtering for advanced thin-film materials.

The nanoPVD-S10A brings high-performance sputtering capability into a compact benchtop platform, supporting metals, oxides, nitrides, multilayers, and exploratory materials R&D.

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SubstratesUp to 4"

Base pressure<5E-07 mbar

SourcesUp to 3 magnetrons

nanoPVD-S10A benchtop magnetron sputtering PVD system in a laboratory

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nanoPVD-S10A benchtop PVD system — nanoPVD-S10A

nanoPVD benchtop PVD system close-up — nanoPVD

nanoPVD substrate rotation assembly — Substrate rotation

nanoPVD chamber and deposition hardware detail — DSC00394

Benchtop PVD system with three magnetron sources

Research-grade sputtering in a compact benchtop platform

The nanoPVD-S10A is compact enough for research laboratories and cleanrooms, while using high-end vacuum, source and control hardware for controlled thin-film deposition. It is optimised for RF and DC magnetron sputtering of metals and insulating materials, giving research teams a practical platform for repeatable materials development.

Compact footprint for research labs and cleanrooms
RF/DC compatibility for a broad material range
Configurable sources and gas handling
Recipe-driven operation via touchscreen HMI
Designed for serviceability and long-term use

Benefits that matter in a working research lab

Faster experimental cycles

Keep early-stage sputtering work close to the research group, reduce waiting time and make process changes without competing for flagship cleanroom capacity.

Ease of use for mixed-experience teams

A touchscreen HMI, compact layout and straightforward maintenance help new users build confidence while still working on genuine research-grade sputtering processes.

Research-grade flexibility

RF and DC sputtering capability supports metals and insulating materials, including reactive and co-deposition methods for more advanced film stacks.

Lower operational friction

The benchtop format helps departments add local PVD capability without creating the access, facility and training burden associated with larger infrastructure.

Better use of premium tools

Develop and screen baseline recipes locally, then transfer mature work to larger shared systems only when the process is ready.

Designed for real devices

Useful for contact layers, seed films, functional coatings, TCO/dielectric studies, reactive sputtering and multi-material research workflows.

Key features for thin-film process development

Designed for laboratories that need repeatable sputtering capability without production-scale complexity.

Compact benchtop design

Advanced PVD capability in a space-efficient format for research labs, teaching spaces and cleanrooms.

RF/DC magnetron sputtering

DC sputtering for conductive materials and RF sputtering for conductive and non-conductive materials such as oxides and nitrides.

High-vacuum performance

Turbomolecular pumping supports low-contamination operation with base pressure below 5E-07 mbar.

Reactive sputtering capability

Gas and pressure control can support up to three process gases for oxide, nitride and compound film development.

Recipe-based touchscreen control

Touchscreen HMI with fully automatic operation and the ability to define and save multiple process recipes.

Configurable source and gas options

Up to three water-cooled magnetron sources for industry-standard 2" targets, with co-deposition and reactive process options.

Typical nanoPVD-S10A configurations

Start with a proven configuration, then tailor source, gas, stage and monitoring options around your materials and target films.

Metals deposition

For conductive films, contact metals, electrodes and exploratory materials work where reliable DC sputtering and practical geometry control matter.

Two magnetrons with DC power supply
SputterSwitch module for shared output
Substrate Z-shift and bi-shutter for best 4" substrate geometries
Quartz crystal sensor head for rate and thickness calibration

TCO / dielectrics sputtering

For transparent conductive oxides, dielectric coatings and process approaches that benefit from RF power and oxygen control.

Two magnetrons with RF power supply
SputterSwitch module for shared output
Substrate heating and additional oxygen process gas line
Substrate Z-shift, bi-shutter and quartz crystal sensor head

Reactive / co-deposition

For flexible materials R&D where researchers need source routing, multiple gases and mixed RF/DC process capability.

Three magnetrons with RF and DC power supplies
SputterSwitch for flexible power supply/source routing
Three process gases, for example argon, oxygen and nitrogen
Reactive deposition of oxides and nitrides

Not sure which configuration you need?

Discuss Your Application

Options and upgrades

Configure the platform around the process approach, substrate handling, automation and laboratory services your application needs. Options are confirmed with quotation for the final build.

Vacuum and gas handling

Dry backing pump
Fast chamber vent
Capacitance manometer and optional MFC closed-loop pressure control
Up to 3 MFC-controlled process gases

Deposition and power

Up to 3 x 2" water-cooled magnetron sputtering sources
780 W DC and/or 150 W, 13.56 MHz RF power supplies with auto-match
High-strength magnet pack for magnetic target sputtering
SputterSwitch source/power routing where specified
In-situ rate and thickness monitoring

Substrate handling

Substrate heating up to 500°C; up to 600°C with 4-bulb configuration
Substrate cooling option
RF and DC substrate bias option
Rotation, Z-shift and shutters where specified

Technical specifications

Exact specifications depend on final configuration and should be confirmed with quotation.

System type	Benchtop PVD / DC and RF magnetron sputtering
Base pressure	5×10^-7 mbar
Pressure control	Capacitance manometer + MFC closed-loop control as an option
Process gas inlets	Up to 3 MFC-controlled gases
Sputter sources	Up to 3 x 2" water-cooled magnetrons
Target size	2"
Reactive sputtering	Yes; up to 3 MFCs with optional closed-loop control
Magnetic target sputtering	High-strength magnet pack available
Maximum substrate size	4" (100 mm)
Substrate heating	Up to 500°C optional; up to 600°C with 4-bulb configuration
Substrate cooling	Available as an option
Substrate bias	RF and DC bias available as an option
Load lock	Not available as standard
Glovebox compatible	No
Process control	Industrial PLC + 7" HMI touchscreen
Recipe control	Recipe save/load standard
Footprint	800 x 500 x 550 mm
Warranty	2 years

Applications

Application-library examples and Bioz lookup results showing nanoPVD-S10A sputtering used in published thin-film, sensor, coating, graphene and device-R&D work.

Influence of DC Sputtering Power on Ti Films

Publication Title: Influence of Sputtering DC Sputtering Power on the Surface Evolution of Ti Thin Films: A Fractal Description

Lead facility: University of Johannesburg