Skip to content

PVD, CVD and Etch Systems

PVD, CVD and Etch Systems

Menu
Menu

nanoPVD-S10A

The nanoPVD-S10 is a benchtop system optimised for RF and DC magnetron sputtering of metals and insulating materials. As compact as an electron microscopy coater, but with high-end hardware for research-grade results.

nanoPVD-S10A Benchtop PVD System

Optimised for magnetron sputtering for substrates up to 4″ diameter. Compatible with DC and/or RF power supplies for deposition of metals or insulating materials such as oxides or nitrides.

Magnetrons (up to 3 can be fitted) are water-cooled, allowing for high powers and sustained operation, and sized for accepting industry-standard targets. Units have turbomolecular pumping systems for low-contamination operation. Co-deposition is possible, as is reactive sputtering via the gas/pressure control module that can support up to 3 process gases.

Chamber access is via a hinged lid, that opens to reveal a stage suitable for holding substrates up to 4″ diameter.

The units are easy to control via a touchscreen interface, simple to maintain, have low running costs and come with a comprehensive range of safety features.

Options
  • Dry backing pump
  • Fast chamber vent
  • Automatic high-resolution pressure control
  • Additional process gases
  • Stage heating to 500°C
  • Substrate rotation, Z-shift and shutters
  • Up to 3 magnetron sputtering sources
  • RF and/or DC power supplies
  • SputterSwitch power supply/source switching technology
  • Co-deposition
  • In-situ rate and thickness monitoring
Key features
  • Benchtop configuration
  • Water-cooled magnetron sputtering sources for industry-standard 2″ targets
  • Process gas introduction via Mass Flow Controllers
  • DC and/or RF power supplies
  • Fully automatic operation via touchscreen HMI
  • Define/save multiple process recipes
  • Up to 4” diameter substrates
  • Base pressures <5E-07 mbar
  • Equipped for easy servicing
  • Comprehensive safety features
  • Cleanroom compatible
  • Proven performance
Typical configurations

Metals deposition:
2 magnetrons with DC power supply and SputterSwitch module for shared output, substrate Z-shift and bi-shutter for best 4″ substrate geometries, quartz crystal sensor head for rate/thickness calibration.

TCO/dielectrics sputtering:
2 magnetrons with RF power supply and SputterSwitch module for shared output, substrate heating and additional oxygen process gas line for enhanced film properties, substrate Z-shift and bi-shutter. Quartz crystal sensor head.

Reactive/co-deposition:
3 magnetrons with RF and DC power supplies and SputterSwitch module for fully-flexible power supply/source routing. 3 process gases (argon, oxygen and nitrogen) for reactive deposition of oxides and nitrides.

Service requirements

All nanoPVD-S10A systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power. Exact requirements will be provided with quotations or on request.