Thermal evaporation sources A thermal evaporation (TE) component typically consists of power supply rods, usually fashioned from thick copper, mounted to feedthroughs that allow transmission of current from an air-side power supply network through to a high-vacuum process chamber. Clamped between the power legs is a resistive support on which the material to be evaporated […]
Four recent installations in London, Sweden, and Norway
Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available.
The basics of Vacuum Evaporation Low temperature evaporation is a recent development in the field of vacuum evaporation. Traditional vacuum evaporation methods work, essentially, by heating materials to high temperatures. This is required for common thin-film evaporants so that they are vapourised from a source. The evaporants then move up through a process chamber to […]
Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a range of materials, primarily metals.
Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the 10-7 mbar region, or lower). This in-turn releases a vapour that moves up through a process chamber and coats a substrate at the top.
We recently launched the latest model in our compact (benchtop) nanoPVD range, the model T15A. With research-grade thermal evaporation capabilities, easy operation and a budget-friendly price, this system is already proving extremely popular!