Plasma etching is an excellent way to clean substrate surfaces, promote adhesion and optimise sample quality layers
The nanoPVD-S10A-WA is a Wide-Area configuration that extends the capabilities of the nanoPVD-S10A to allow for even coating of substrate diameters up to 8″, in a benchtop package. RF and DC magnetron sputtering allow for deposition of both metals and insulating materials.
While keeping the same chamber design, the Wide-Area version of the nanoPVD-S10A contains magnetron sputtering sources oriented directly upwards towards substrate platens. This arrangement in combination with substrate rotation and exposure plates with specially-designed orifices allows for coating of substrates up to 8″ diameter for applications in which tight uniformity specifications are not critical.
Like the nanoPVD-S10A, magnetrons are water-cooled for sustained high-power operation and accept industry-standard targets. In addition, nanoPVD-S10A-WA units come with all attractive features of the nanoPVD range including turbomolecular pumping systems, recipe-based automated operation via touchscreen HMIs, and compact designs for benchtop location.
All nanoPVD-S10A systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power.
Exact requirements will be provided with quotations or on request.