This paper reports the fabrication metal-insulator-metal (MIM) diodes based on
MiniLab 080 systems offer tall chambers ideally suited for thermal, LTE and e-beam evaporation techniques requiring longer working distances for optimum uniformity.
Techniques: Thermal evaporation // Low-temperature thermal evaporation (LTE) // E-beam evaporation // Magnetron sputtering
The MiniLab 080 standard configuration includes a turbomolecular pump positioned on an ISO160 port at the rear of the vacuum chamber. The vacuum chamber sits on a double-rack frame that contains all system control electronics and power supplies. MiniLab 080 systems are available with load-locks—please call for details.
The tools are ideally suited to evaporation techniques where long working distances are required for best uniformity, and where evaporant incident angles close to 90° allow for optimal results for lift-off applications. However, as well as thermal, LTE and e-beam evaporation, the tools can also be fitted for magnetron sputtering (commonly as a multi-technique system).
Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.
*Magnetron sputtering sources can be added alongside the above techniques.
All MiniLab 080 tools require chilled water, dry compressed air, nitrogen for venting (optional) and electrical power (three-phase for e-beam evaporation). Sputtering systems also require process gases (argon, oxygen and nitrogen). Exact requirements will be provided with quotations or on request.