This paper reports the fabrication metal-insulator-metal (MIM) diodes based on alkyltrichlorosilane self-assembled monolayers (SAMs) and investigation of the effects of parameters such as alkyl chain length on the electronic properties, for applications in high speed electronics.
MiniLab 080 systems offer tall chambers ideally suited for thermal, LTE and e-beam evaporation techniques requiring longer working distances for optimum uniformity.
Techniques: Thermal evaporation // Low-temperature thermal evaporation (LTE) // E-beam evaporation // Magnetron sputtering
The MiniLab 080 standard configuration includes a turbomolecular pump positioned on an ISO160 port at the rear of the vacuum chamber. The vacuum chamber sits on a double-rack frame that contains all system control electronics and power supplies. MiniLab 080 systems are available with load-locks—please call for details.
The tools are ideally suited to evaporation techniques where long working distances are required for best uniformity, and where evaporant incident angles close to 90° allow for optimal results for lift-off applications. However, as well as thermal, LTE and e-beam evaporation, the tools can also be fitted for magnetron sputtering (commonly as a multi-technique system).
Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.
*Magnetron sputtering sources can be added alongside the above techniques.
All MiniLab 080 tools require chilled water, dry compressed air, nitrogen for venting (optional) and electrical power (three-phase for e-beam evaporation). Sputtering systems also require process gases (argon, oxygen and nitrogen). Exact requirements will be provided with quotations or on request.