Model ST15A offers the combination of evaporation and sputtering techniques within a single process chamber. Ultimate research flexibility within a benchtop, automated package.


Thermal evaporation, Low-temperature evaporation, Magnetron sputtering

High-performance evaporation and magnetron sputtering techniques within one process chamber — all housed in a compact, modular package for benchtop location. Ultimate flexibility for research-grade thin-film deposition requiring a space-friendly footprint.

The latest model in Moorfield’s nanoPVD range, model ST15A has been purpose-designed to accommodate both vacuum evaporation and magnetron sputtering sources within the a single process chamber. Available source types are low-temperature evaporation (LTE), standard resistive evaporation, and magnetron sputtering (2″ targets) for deposition of organics, dielectrics, and metals.

Each process chamber can hold up to 3 sources of up to 2 types. A full range of power supplies are available allowing for deposition of multiple film types — metals, insulators, dielectrics and organics — using the same system and even within the same process run.

As with all nanoPVD tools, chamber access is via a hinged lid, that opens to reveal a stage suitable for holding substrates up to 4″/100 mm diameter. The chamber is tall, allowing for high-uniformity coating via fitted techniques.

The units are easy to control via a touchscreen HMI interface, simple to maintain, have low running costs and come with a comprehensive range of safety features.

With a turbomolecular pumping system, high-vacuum base pressures, straightforward automated control via a touchscreen HMI and a range of options for flexible configuration, the nanoPVD-ST15A combines the proven ease-of-use and high-end performance the nanoPVD range has become known for with ultimate applications flexibility.

Key features

  • Benchtop configuration
  • Magnetron sputtering, thermal evaporation, and low-temperature evaporation
  • Deposition of metals, organics, and dielectrics
  • Flexible source arrangement
  • Up to 3 MFC-controlled process gases
  • Automatic pressure control option
  • Fully automatic operation via touchscreen HMI
  • Up to 4” diameter substrates
  • Sample heating option
  • Base pressures <5 × 10-7 mbar
  • Define/save multiple process recipes
  • Equipped for easy servicing
  • Comprehensive safety features
  • Cleanroom compatible
  • Proven performance


  • Dry backing pump
  • Fast chamber vent
  • Chamber SafeSeal
  • Substrate rotation
  • Substrate Z-shift
  • Source and/or substrate shutters
  • 500 °C substrate heating
  • Co-deposition
  • SputterSwitch technology
  • Up to 3 MFCs
  • High-resolution automatic pressure control
  • Quartz crystal sensor heads

Typical configurations

Sputtering and metals evaporation
1 magnetron with RF power supply (metals and/or dielectrics) and SputterSwitch module for shared output, 2 thermal evaporation sources (metals) with single power supply and switch for shared output.

Automatic pressure control (Ar and O2 process gases), 500 °C substrate heating and quartz crystal sensor head for rate/thickness monitoring.

Sputtering and organics evaporation

2 magnetrons with DC power supply (metals) and SputterSwitch module for shared output, 1 low-temperature evaporation source (organics) with power supply.

Ar process gas, Z-shift and bi-shutter for best 4″ substrate geometries, quartz crystal sensor head for rate/thickness monitoring.

Service requirements

All nanoPVD-S10A systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power. Exact requirements will be provided with quotations or on request.

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