Confocal Magnetron Sputtering

Confocal magnetron sputtering

Multi-layer films by confocal magnetron sputtering  Confocal magnetron sputtering is now routinely employed for the production of excellent uniformity, multi-layer films by magnetron sputtering. This application note describes the technology, and explains the principles behind it.  Figure 1 (a) is a schematic of magnetron sputtering equipment in which the magnetron’s central axis is aligned exactly with […]

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Source Selection for Thermal Evaporation

Thermal evaporation sources

Source types  Thermal evaporation is suitable for depositing a wide variety of materials. To a large extent, the capability of the technique is subject to the type of source fitted. Sources are typically fabricated from tungsten, tantalum or molybdenum, and come in several different forms, e.g., boats, baskets (including those suitable for supporting crucibles), filaments […]

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PVD Techniques

nanoPVD-T15A chamber interior with two TE1 sources for metals evaporation

Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available. Electron-Beam Evaporation Electron-beam (e-beam) evaporation is a type of physical vapour deposition in which a material to be deposited is heated to a temperature at which it evaporates, by bombardment with a beam of electrons. […]

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Magnetron Sputtering

Magnetron sputtering

Magnetron sputtering is a versatile technique suited to a wide range of materials – and provides excellent coating-substrate adhesion. In sputtering, deposition material is ejected from a target surface through bombardment by plasma ions. During the process, the substrate (which is to be coated) is placed inside a vacuum chamber, facing one or more magnetron […]

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Thermal Evaporation

Thermal evaporation

Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a range of materials, primarily metals.  How it works To start, substrates are supported at the top of a process chamber above a component on which the evaporant is supported (known […]

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Electron-Beam Evaporation

Electron Beam Evaporation Moorfield Nanotechnology

Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the 10-7 mbar region, or lower). This in-turn releases a vapour that moves up through a process chamber and coats a substrate at the top. Why use E-beam Evaporation? Evaporant heating […]

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