An introductory explanation of substrate adhesion, and how this can be improved.
Moorfield graphene soft-etching technology allows for the controlled removal of graphene and 2D materials, without cross-linking photoresists that can lead to residual contamination that affects device performance.
Confocal magnetron sputtering is now routinely employed for the production of excellent uniformity, multi-layer films by magnetron sputtering. This application note describes the technology, and explains the principles behind it.
Thermal evaporation sources A thermal evaporation (TE) component typically consists of power supply rods, usually fashioned from thick copper, mounted to feedthroughs that allow transmission
Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available.
Magnetron sputtering is a versatile technique suited to a wide range of materials – and provides excellent coating-substrate adhesion.
The basics of Vacuum Evaporation Low temperature evaporation is a recent development in the field of vacuum evaporation. Traditional vacuum evaporation methods work, essentially, by
Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a range of materials, primarily metals.
Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the 10-7 mbar region, or lower). This in-turn releases a vapour that moves up through a process chamber and coats a substrate at the top.