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Graphene soft-etching with the nanoETCH

Graphene soft-etching Moorfield graphene soft-etching technology allows for the controlled removal of graphene and 2D materials, without cross-linking photoresists that can lead to residual contamination […]

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Confocal magnetron sputtering

Confocal Magnetron Sputtering

Multi-layer films by confocal magnetron sputtering Confocal magnetron sputtering is now routinely employed for the production of excellent uniformity, multi-layer films by magnetron sputtering. This […]

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nanoPVD-T15A chamber interior with two TE1 sources for metals evaporation

PVD Techniques

Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available. Electron-Beam Evaporation Electron-beam (e-beam) evaporation […]

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Magnetron sputtering

Magnetron Sputtering

Magnetron sputtering is a versatile technique suited to a wide range of materials – and provides excellent coating-substrate adhesion. In sputtering, deposition material is ejected […]

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Physical Vapour Deposition

Low Temperature Evaporation

The basics of Vacuum Evaporation Traditional vacuum evaporation methods work, essentially, by heating materials to high temperatures. This is required for common thin-film evaporants so […]

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Thermal evaporation

Thermal Evaporation

Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a […]

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Electron Beam Evaporation Moorfield Nanotechnology

Electron-Beam Evaporation

Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the […]

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