Graphene soft-etching with the nanoETCH

Graphene soft-etching Moorfield graphene soft-etching technology allows for the controlled removal of graphene and 2D materials, without cross-linking photoresists that can lead to residual contamination

Confocal magnetron sputtering

Confocal Magnetron Sputtering

Multi-layer films by confocal magnetron sputtering Confocal magnetron sputtering is now routinely employed for the production of excellent uniformity, multi-layer films by magnetron sputtering. This

Thermal evaporation sources

Source Selection for Thermal Evaporation

Thermal evaporation sources A thermal evaporation (TE) component typically consists of power supply rods, usually fashioned from thick copper, mounted to feedthroughs that allow transmission

nanoPVD-T15A chamber interior with two TE1 sources for metals evaporation

PVD Techniques

Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available. Electron-Beam Evaporation Electron-beam (e-beam) evaporation

Magnetron sputtering

Magnetron Sputtering

Magnetron sputtering is a versatile technique suited to a wide range of materials – and provides excellent coating-substrate adhesion. In sputtering, deposition material is ejected

Physical Vapour Deposition

Low Temperature Evaporation

The basics of Vacuum Evaporation Traditional vacuum evaporation methods work, essentially, by heating materials to high temperatures. This is required for common thin-film evaporants so

Thermal evaporation

Thermal Evaporation

Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a

E-Beam featured

Electron-Beam Evaporation

Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the

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