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PVD Techniques

nanoPVD-T15A

Moorfield are experienced in all common PVD techniques and can supply systems with fully-integrated component sets. Standalone components also available. Electron-Beam Evaporation Electron-beam (e-beam) evaporation is a type of physical vapour deposition in which a material to be deposited is heated to a temperature at which it evaporates, by bombardment with a beam of electrons. […]

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Magnetron Sputtering

Magnetron sputtering

Magnetron sputtering is a versatile technique suited to a wide range of materials – and provides excellent coating-substrate adhesion. In sputtering, deposition material is ejected from a target surface through bombardment by plasma ions. During the process, the substrate (which is to be coated) is placed inside a vacuum chamber, facing one or more magnetron […]

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Thermal Evaporation

Thermal evaporation

Thermal evaporation is the most straightforward physical vapour deposition (PVD) technique, in terms of both mechanism and system configuration. The method is suitable for depositing a range of materials, primarily metals.  How it works To start, substrates are supported at the top of a process chamber above a component on which the evaporant is supported (known […]

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Electron-Beam Evaporation

Electron Beam Evaporation Moorfield Nanotechnology

Like all evaporative physical vapour deposition (PVD) methods, electron-beam evaporation (also known as e-beam evaporation) involves heating a material under vacuum conditions (typically in the 10-7 mbar region, or lower). This in-turn releases a vapour that moves up through a process chamber and coats a substrate at the top. Why use E-beam Evaporation? Evaporant heating […]

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