Minilab 060

MiniLab

060

  • Minilab 060 tool for magnetron sputtering with RF and DC power supplies

  • Minilab 060 process chamber with shuttered viewport

  • Close-up of MiniLab 060 shuttered viewport

  • Minilab 060 process chamber with water channels for chamber cooling/heating

  • Magnetrons fitted to inside of MiniLab 060 chamber

  • Load lock with gas cooling station

  • Inside a MiniLab 060 chamber

  • Inside a MiniLab 060 chamber

  • Inside a MiniLab 060 chamber

  • Minilab 060 substrate stage with CCC element for 800 °C platen temperatures

  • Minilab 060 chamber top with feedthroughs for heater

  • Inficon SQC-310 for automated control according to user-defined rates and thicknesses—as measured via quartz crystal sensor heads

  • MiniLab 060 systems are cleanroom-compatible deposition tools

  • All MiniLab 060 tools can be customised. Here, a MiniLab 060 magnetron sputtering tool and MiniLab 080 e-beam evaporation system are connected via a shared central load-lock

  • RF and DC power supplies mounted in the electronics rack of a MiniLab 060 magnetron sputtering tool. Recipe-based automated control is via a touchscreen HMI or PC

 

The most popular platform in our MiniLab range, MiniLab 060 systems have front-loading box-type chambers ideal for multiple-source magnetron sputtering but also thermal and e-beam evaporation.

The MiniLab 060 standard configuration includes a turbomolecular pump positioned on an ISO160 port at the rear of the vacuum chamber. The vacuum chamber sits on a double-rack frame that contains all system control electronics and power supplies. MiniLab 060 systems are available with load-locks—please call for details. Tools can be equipped with a wide variety of deposition techniques, including thermal and low-temperature evaporation sources (for metals and organics), magnetron sputtering cathodes (for metals and inorganics), and electron-beam sources (for most material classes except organics). Deposition sources are typically mounted on the chamber baseplate, but sputter-down configurations are also available. Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.

Key Features:

  • Modular design
  • Front-loading box-type vacuum chamber
  • Turbomolecular and cryo pumping systems
  • Base pressures <5 × 10-7 mbar
  • Metals, dielectrics and organics deposition
  • Up to 11” diameter substrates
  • Touchscreen HMI/PC for system control
  • Equipped for easy servicing
  • Comprehensive safety features and interlocks
  • Cleanroom compatible
  • Load-locks available

Techniques:

MiniLab 060 systems can be fitted with the following techniques:

  • Thermal evaporation
  • Low-temperature thermal evaporation (LTE)
  • E-beam evaporation
  • Magnetron sputtering

Options:

Available options include:

  • Pumping: Turbomolecular or cryogenic high-vacuum pumps, rotary or scroll backing pumps.
  • Gas/pressure: Manual or automatic control via MFCs and throttle valves.
  • Load-locks: Single- and multiple-sample.
  • Stages: Rotation, heating, cooling, Z-shift, bias and planetary.
  • Shutters: Source and substrate, pneumatic or motorised.
  • Operation: Manual or automatic via front panels, touchscreen HMI or PC.
  • Process: Quartz crystal sensor heads for rate/thickness monitoring or feedback-loop control.

Typical Configurations:

MiniLab 060 instruments are available in a variety of configurations. Common examples include:

  • Thermal evaporation (metals): Four-source TE4 thermal evaporation component with source shutters and rotation stage. High power TEC-4A power supply and controller with recipe-based automated control. Quartz crystal sensor head with PC software for rate/thickness monitoring.
  • Thermal evaporation (metals and organics): Two TE1 thermal evaporation sources for metals and two LTE-1CC components for organics. Source shutters and rotation stage. Evaporation power supplies linked to quartz crystal sensor head and Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
  • E-beam evaporation: Multi-pocket (e.g., 6 × 7 cc or 8 × 4 cc) water-cooled e-beam source with 5 kW power supply/controller and automated pocket selection. Source and substrate shutters, and rotation. Quartz crystal sensor heads with Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
  • Magnetron sputtering: Up to four water-cooled magnetron sources for 3" circular targets. RF and DC power supplies with SputterSwitch technology for shared outputs. Source shutters and substrate rotation. Recipe-based power vs. time process control.



Call us today to discuss your requirements!

Service Requirements:

All MiniLab 060 tools require chilled water, dry compressed air, nitrogen for venting (optional) and electrical power (three-phase for e-beam evaporation).

Sputtering systems also require process gases (argon, oxygen and nitrogen).

Exact requirements will be provided with quotations or on request.

 
© 2017 Moorfield Nanotechnology Limited.